[wheel size：1A 760*75*304.8 GC 80 I 14 V 4M]
[grinding method：cylindrical grinding]
[workpiece material：SUS303]
[workpiece size：100*1000-1500]

Thanks to reduction of chip-cloggings and good cutting performance, PTⅡ proovides reducttion of the frequency of dressing and grinding time. As a result, grinding capacity doubled.

[wheel size：1A 350*38*76.2 GC 80 H 15 V 4M]
[grinding method：cylindrical grinding]
[workpiece material：SUS304]
[workpiece size：95]

PTⅡ resolved the problems of chips clogging and dressing frequency, and provided good surface roughness and reduction of grinding time at one-tenth.

[wheel size：1A 180*13*31.75 GC 80 H 15 V 4M]
[grinding method：surface grinding]
[workpiece material：copper]

PTⅡ provides reduced grinding heat, good cutting performance and good surface roughness.

[wheel size：1A 510*50*127 GC 60 H 15 V 4M]
[grinding method：surface grinding]
[workpiece material：ductile 400]

Thanks to few chip clogging and reduced grinding burning, a workpiece is ground without dressing.